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Transformer-based deep learning models like GPT-3 have been getting much attention in the machine learning world. These models excel at understanding semantic relationships, and they have contributed to large improvements in Microsoft Bing’s search experience. However, these models can fail to capture more nuanced relationships between query and document terms beyond pure semantics.

The Microsoft team of researchers developed a neural network with 135 billion parameters, which is the largest “universal” artificial intelligence that they have running in production. The large number of parameters makes this one of the most sophisticated AI models ever detailed publicly to date. OpenAI’s GPT-3 natural language processing model has 175 billion parameters and remains as the world’s largest neural network built to date.

Microsoft researchers are calling their latest AI project MEB (Make Every Feature Binary). The 135-billion parameter machine is built to analyze queries that Bing users enter. It then helps identify the most relevant pages from around the web with a set of other machine learning algorithms included in its functionality, and without performing tasks entirely on its own.

Deployment of functional circuits on a 3D freeform surface is of significant interest to wearable devices on curvilinear skin/tissue surfaces or smart Internet-of-Things with sensors on 3D objects. Here we present a new fabrication strategy that can directly print functional circuits either transient or long-lasting onto freeform surfaces by intense pulsed light-induced mass transfer of zinc nanoparticles (Zn NPs). The intense pulsed light can locally raise the temperature of Zn NPs to cause evaporation. Lamination of a kirigami-patterned soft semi-transparent polymer film with Zn NPs conforming to a 3D surface results in condensation of Zn NPs to form conductive yet degradable Zn patterns onto a 3D freeform surface for constructing transient electronics. Immersing the Zn patterns into a copper sulfate or silver nitrate solution can further convert the transient device to a long-lasting device with copper or silver. Functional circuits with integrated sensors and a wireless communication component on 3D glass beakers and seashells with complex surface geometries demonstrate the viability of this manufacturing strategy.

As the United States looks beyond war in Afghanistan and Iraq, the military is preparing for conflict in new domains, from outer space to cyberspace.
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Austin-based Silicon Labs has sold its infrastructure and automotive business for $2.75 billion to California-based semiconductor maker Skyworks Solutions. Plans for the all-cash deal was initially announced in April.

Silicon Labs primarily designs semiconductors and other silicon devices. CEO Tyson Tuttle said the deal will allow the company to focus on its growing Internet of Things business. Internet of Things, or IoT as it is known in industry shorthand, refers to a range of non-computing devices —from kitchen devices to security systems — that connect to the Internet.

Silcon Labs’ IoT business already serves tens of thousands of customers and works in thousands of applications, but the deal narrows Silicon Labs focus exclusively to that technology.

Arm thinks those kinds of applications may not be far away, though. In a paper published last week in Nature, researchers from the company detailed a 32-bit microprocessor built directly onto a plastic substrate that promises to be both flexible and dramatically cheaper than today’s chips.

“We envisage that PlasticARM will pioneer the development of low-cost, fully flexible smart integrated systems to enable an ‘internet of everything’ consisting of the integration of more than a trillion inanimate objects over the next decade into the digital world,” they wrote.

Flexible electronics aren’t exactly new, and sensors, batteries, LEDs, antennae, and many other simpler components have all been demonstrated before. But a practical microprocessor that can carry out meaningful computations has been elusive thanks to the large number of transistors required, say the researchers.

A microchip in your lettuce? Why not, says Arm.


Chip designer Arm has unveiled the most complex flexible microchip yet. The PlasticARM is inefficient and slow compared to silicon-based chips, but could be printed onto fabric, paper, and plastic, allowing for what Arm calls the “internet of everything.”