Tiny integrated circuits destined for space missions, etched onto a single wafer of silicon, examined under a magnifier.

To save money on the high cost of fabrication, various chips designed by different companies and destined for multiple ESA projects are crammed onto the same silicon wafers, etched into place at specialised semiconductor manufacturing plants or ‘fabs’.

Once manufactured, the chips, still on the wafer, are tested. The wafers are then chopped up. They become ready for use when placed inside protective packages – just like standard terrestrial microprocessors – and undergo final quality tests.