Diamond is the hardest material in nature. But out of many expectations, it also has great potential as an excellent electronic material. A joint research team led by City University of Hong Kong (CityU) has demonstrated for the first time the large, uniform tensile elastic straining of microfabricated diamond arrays through the nanomechanical approach. Their findings have shown the potential of strained diamonds as prime candidates for advanced functional devices in microelectronics, photonics, and quantum information technologies.

The research was co-led by Dr. Lu Yang, Associate Professor in the Department of Mechanical Engineering (MNE) at CityU and researchers from Massachusetts Institute of Technology (MIT) and Harbin Institute of Technology (HIT). Their findings have been recently published in the prestigious scientific journal Science, titled “Achieving large uniform tensile elasticity in microfabricated diamond”.

“This is the first time showing the extremely large, uniform elasticity of diamond by tensile experiments. Our findings demonstrate the possibility of developing electronic devices through ‘deep elastic strain engineering’ of microfabricated diamond structures,” said Dr. Lu.